This paper presents a newly developed integratedheating system, which can keep the IC under test at a constanttemperature of up to 250 ◦C. The heating system can be usedwhile the IC under test is mounted on its custom-designedinterface board, which controls the two supply voltages andprovides connectivity to an FPGA. Using a testing framework onthe FPGA, the test stimuli and operating clock can be providedwith at least 100 MHz. Thus, it is possible to fully vary allthree parameters—frequency, voltage, and temperature—duringcontinuous operation of the IC. A case study is performed witha previously fabricated ASIC to test the proposed system.