Process Development for Batch Production of Micro-Milling Tools Made of Silicon Carbide by Means of the Dry Etching Process

Abstract

Downsized and complex micro-machining structures have to meet quality requirements concerning geometry and convince through increasing functionality. The development and use of cutting tools in the sub-millimeter range can meet these demands and contribute to the production of intelligent components in biomedical technology, optics or electronics. This article addresses the development of double-edged micro-cutters, which consist of a two-part system of cutter head and shaft. The cutting diameters are between 50 and 200 μm. The silicon carbide cutting heads are manufactured from the solid material using microsystem technology. The substrate used can be structured uniformly via photolithography, which means that 5200 homogeneous micro-milling heads can be produced simultaneously. This novel batch approach represents a contrast to conventionally manufactured micro-milling cutters. The imprint is taken by means of reactive ion etching using a mask made of electroplated nickel. Within this dry etching process, characteristic values such as the etch rate and flank angle of the structures are critical and will be compared in a parameter analysis. At optimal parameters, an anisotropy factor of 0.8 and an etching rate of 0.34 µm/min of the silicon carbide are generated. Finally, the milling heads are diced and joined. In the final machining tests, the functionality is investigated and any signs of wear are evaluated. A tool life of 1500 mm in various materials could be achieved. This and the milling quality achieved are in the range of conventional micro-milling cutters, which gives a positive outlook for further development.