The Grain Boundary Wetting Phenomena in the Ti-Containing High-Entropy Alloys: A Review

Abstract

In this review, the phenomenon of grain boundary (GB) wetting by melt is analyzed for multicomponent alloys without principal components (also called high‐entropy alloys or HEAs) containing titanium. GB wetting can be complete or partial. In the former case, the liquid phase forms the continuous layers between solid grains and completely separates them. In the latter case of partial GB wetting, the melt forms the chain of droplets in GBs, with certain non‐zero contact angles. The GB wetting phenomenon can be observed in HEAs produced by all solidification‐based technologies. GB leads to the appearance of novel GB tie lines Twmin and Twmax in the multicomponent HEA phase diagrams. The so‐called grain‐boundary engineering of HEAs permits the use of GB wetting to improve the HEAs’ properties or, alternatively, its exclusion if the GB layers of a second phase are detrimental.