Denkena, B.; Krödel, A.; Lang, R.: Fabrication and use of Cu-Cr-diamond composites for the application in deep feed grinding of tungsten carbide. In: Diamond and Related Materials 120 (2021), 108668. DOI: https://doi.org/10.1016/j.diamond.2021.108668
Abstract: | |
Machining of tungsten carbide requires the use of highly wear resistant grinding tools, like metal bonded grinding tools. The abrasive layer of these grinding tools can be regarded as Metal-Matrix-Composites reinforced with diamond particles. Copper-Matrix-Composites already are being used as heat sink materials through their outstanding high thermal conductivity. In this work, Cu/Diamond composites with 50 vol% diamond have been fabricated through field assisted sintering and the application of these composites as grinding layers in a deep feed grinding process of tungsten carbide was investigated. Through addition of chromium powder as a carbide former on the surface of the diamond particles, the critical bond strength and therefore the diamond grain retention was significantly increased by +363%. The addition of 2 wt% chromium to the copper matrix also resulted in a +84% increase of thermal conductivity relatively to the chromium free Cu/Diamond composite. Grinding of tungsten carbide as a dynamic stress test showed that the increased grain retention and thermal conductivity resulted in a decrease in grinding layer wear. Further chromium addition to 8 wt% chromium resulted in a decrease in thermal conductivity and the formation of adhesive cloggings on the grinding wheel surface during grinding. | |
License of this version: | CC BY-NC-ND 4.0 Unported |
Document Type: | Article |
Publishing status: | publishedVersion |
Issue Date: | 2021 |
Appears in Collections: | Fakultät für Maschinenbau |
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