This paper introduces a new manufacturing process for vertical interconnect accesses (VIA). In contrast to industrially established VIA metallization technologies, the presented approach takes place without any chemical ...

Improving the light trapping in a module results in an increase in the generated current. Consequently, an optimization of the front grid metallization of the cell is required for the best trade-off between series resistance, ...

The back end process of passivated emitter and rear cells (PERC) consists of at least one laser process and three screen-printing steps followed by the stringing and tabbing of the cells. To reduce the number of steps we ...